News Release
Release of CSP+, a description language specification for the description of device profiles
Integration of Engineering Tools and Manual-less and Program-less Operation Release of CSP+ description
language specification for the description of device profiles
The CC-Link Partner Association (CLPA; Chairman: Takashi Sekiguchi, Professor Emeritus, Yokohama National University; Supporting companies: IDEC Corporation, 3M Company, Cognex Corporation, Digital Electronics Corporation, NEC Corporation, Mitsubishi Electric Corporation), which promotes the open field network CC-Link, announces the release of “CSP+”, a description language specification for describing device profiles.
Background
The CC-Link Family System Profile (CSP+) is a specification that describes the information necessary for
setup, operation, and maintenance of CC-Link Family-compatible devices.
Previously, the CC-Link System Profile (CSP) was used to describe such information for CC-Link
compatible products. However, since the formulation of the CSP specification, the need for a profile
specification with higher descriptiveness has increased due to the following reasons:
1. Increased complexity of functions
Previously, single-function products with few settings were mainstream, but in recent years, high-functionality products capable of complex settings and control have been increasing.
2. Diversification of engineering tool applications
The purposes of engineering tools have diversified beyond just input/output and parameter settings to include diagnostics, energy management, etc.
3. Diversification of networks
In addition to CC-Link, protocols such as CC-Link IE Field Network and SLMP have appeared, diversifying the ways to connect various devices to networks.
Against this background, we have newly defined CSP+ as a profile specification for CC-Link Family-compatible devices.
Features of CSP+
1. Benefits for developer vendors
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Integration of engineering tool environments
Developer vendors of CC-Link Family-compatible products only need to create a CSP+ file corresponding to the product they develop; there is no need to create individual engineering tools. Furthermore, by describing profiles tailored to specific applications such as diagnostics and energy management, dedicated screens with layouts specialized for each purpose can be displayed in the engineering tool.
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Integration of profile specifications
With CSP+, developer vendors can describe profiles in the same format even for products connected via different communication protocols within the CC-Link Family (such as CC-Link or CC-Link IE Field).
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Adoption of XML format
Since CSP+ files are described in XML format, general-purpose XML processing libraries can be used. This allows developer vendors to reduce the man-hours required for profile development.
2. Benefits for users
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Multi-language support
CSP+ is designed for global use and supports multiple languages. When a developer vendor creates a multi-language CSP+ file, users in each country can use it in their native language.
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Reliable quality certified by conformance testing
CLPA establishes CSP+ settings through conformance testing, so users can use it with peace of mind. CSP+ files provided by each vendor can be downloaded from the CLPA website or the vendor’s website.
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Manual-less operation
Since memory maps, address names, etc. are described in the CSP+ file, users can perform programming and monitoring without manuals. Parameter setting programs can also be omitted.
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Centralized management from a single engineering tool
By importing the CSP+ file into the engineering tool during unit setup, operation, and maintenance, all units connected to the CC-Link Family can be managed from the same engineering tool.
CSP+ operation method
The operation method of CSP+ is as follows:
- Using the CSP+ creation support tool, the developer vendor creates a profile for CC-Link Family-compatible devices.
- After completing the file, CLPA conducts a conformance test and publishes certified files on the CLPA homepage.
- Users download the CSP+ file describing the profile of the device from the CLPA homepage or the developer vendor’s homepage.
- Users purchase an engineering tool that supports CSP+, import the downloaded CSP+ file, and perform device engineering.
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Future schedule
| Details | Period | |
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| 1 | Publication of CSP+ specification document by CLPA | April 13, 2012 |
| 2 | Publication of CSP+ creation support tool for developer vendors on the CLPA homepage | Around summer 2012 |
| 3 | Sequential publication of CSP+ files created by CC-Link Family-compatible product developer vendors on CLPA and vendor homepages | From summer 2012 onward |
As described above, we are confident that opening a more descriptive profile specification will strongly
support everyone in an era where needs for network technology are becoming increasingly diverse.
The CC-Link Partner Association will continue its efforts to promote adoption both domestically and
internationally, transcending borders, to contribute to technological innovation in the FA field.
April 13, 2012
CC-Link Partner Association (CLPA)
Contact
CC-Link Partner Association Secretariat
Ozone Front Bldg. 6F, 3-15-58 Ozone, Kita-ku, Nagoya 462-0825, enpan
TEL: 052-919-1588 FAX: 052-916-8655
URL: https://www.cc-link.org/