Report on CLPA's participation in “SEMICON Japan 2008”

Date：Dec 3 (Wed) to 5 (Fri), 2008
Place：Makuhari Messe

CLPA exhibited at SEMICON Japan 2008.
At the booth, we introduced the concept of CC-Link IE Field Network, which best fits to solve the large size wafer issue and EES configuration that semiconductor industry manufactures are facing. We had a lot of practical discussions with semiconductor device manufactures, equipment manufactures and vendor manufactures.
CC-Link IE Field Network is scheduled to open its specification next year, and the specification will start to be discussed at CLPA technical task force. CLPA appreciates your opinion and participation in the task force working.
Thank you for coming to the CLPA booth!